149 packaging engineer job offers
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Advanced Packaging Process Integration Principal/ Staff...
Applied Materials D1, Singapore, Singapore
...Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid BondingPlan wafer splits/ lot run with design of...
9 days ago in WhatjobsReport -
Principal Engineer, Wafer-Level Packaging & APTD Tech
Micron Singapore, Singapore
A global semiconductor company in Singapore seeks a qualified individual to develop and enable processes in semiconductor manufacturing. The candidate will be r
13 days ago in JobleadsReport -
Senior Clean Tech Process Engineer - 300mm Packaging
GLOBALFOUNDRIES Singapore, Singapore
A leading semiconductor foundry in Singapore is seeking an Experienced Clean Technology Process Engineer to contribute to the 300mm Advance Packaging Center...
30+ days ago in JobleadsReport -
Engineer, APTD CEM - Advanced Packaging Equipment...
Micron Singapore, Singapore
...inclusion, collaboration, and continuous improvement. Key responsibilities and duties include: Equipment Development: Develop and optimize advanced packaging...
16 days ago in FounditReport -
Principal Engineer/MTS Advanced Packaging Diffusion Process...
GLOBALFOUNDRIES Singapore, Singapore
...their markets. For more information, visit. *Introduction: *Globalfoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer...
30+ days ago in JobleadsReport -
Advanced Packaging Process Integration Principal/ Staff...
Applied Materials Singapore, Singapore
Advanced Packaging Process Integration Principal/ Staff Engineer page is loaded# Advanced Packaging Process Integration Principal/ Staff Engineerlocations...
30+ days ago in JobleadsReport -
Equipment Engineer (PVD) — Wafer-Level Packaging Innovator
STATS ChipPAC D18, Singapore, Singapore
A global semiconductor company based in Singapore is seeking a dedicated Equipment Maintenance Engineer to ensure optimal performance in production. The role...
26 days ago in JobrapidoReport -
Advanced Packaging Process Integration Principal/ Staff...
Applied Materials Singapore, Singapore
...and delivered on time. Responsibilities Develop 2.5D/3D process technologies and solutions for Advanced Packaging including Bump/ Re‑Distribution Layer,
30+ days ago in JobleadsReport -
Engineer, APTD CEM - Advanced Packaging Equipment...
Micron Singapore, Singapore
...we foster a culture of inclusion, collaboration, and continuous improvement. Responsibilities Equipment Development: Develop and optimize advanced packaging...
13 days ago in JobleadsReport -
Principal/Sr Engineer, Advance Packaging Process...
Micron Technology Singapore, Singapore
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in th
21 days ago in FounditReport -
Equipment Engineer (PVD) — Wafer-Level Packaging Innovator
STATS ChipPAC Singapore, Singapore
A global semiconductor company based in Singapore is seeking a dedicated Equipment Maintenance Engineer to ensure optimal performance in production. The role...
24 days ago in JobleadsReport -
Equipment Engineer (PVD) — Wafer-Level Packaging Innovator
STATS ChipPAC D8, Singapore, Singapore
A global semiconductor company based in Singapore is seeking a dedicated Equipment Maintenance Engineer to ensure optimal performance in production. The role...
26 days ago in JobrapidoReport -
Equipment Engineer (PVD) — Wafer-Level Packaging Innovator
STATS ChipPAC Clementi, Singapore, Singapore
A global semiconductor company based in Singapore is seeking a dedicated Equipment Maintenance Engineer to ensure optimal performance in production. The role...
26 days ago in JobrapidoReport -
Engineer, APTD CEM - Advanced Packaging Integration...
Micron Singapore, Singapore
Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micr
11 days ago in JobleadsReport -
Principal/Sr Engineer, Advance Packaging Process...
Micron Singapore, Singapore
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring th
23 days ago in FounditReport -
Principal/Sr Engineer, Advance Packaging Process...
Micron Technology D1, Singapore, Singapore
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in th
9 days ago in WhatjobsReport -
Senior Assembly & NPI Engineer (Silicon Packaging)
Avago Technologies Singapore, Singapore
A technology company in Singapore is seeking an experienced individual to manage silicon bump and package assembly suppliers. You will be responsible for drivin
30+ days ago in JobleadsReport -
Senior Principal Engineer, Systems Engineering (Advanced...
ASM FRONT-END MANUFACTURING SINGAPORE PTE. D25, Singapore, Singapore
...packaging trends and emerging semiconductor technologies. Excellent communication and collaboration skills to influence across teams. Apply today to be part...
30+ days ago in FounditReport -
Assembly & Packaging Engineer – Photonics...
Lyte Tuas, West Region
A technology company based in Singapore seeks an entry to mid-level assembly and packaging engineer. The role involves supporting packaging process...
28 days ago in JobrapidoReport -
Engineer, APTD CEM - Advanced Packaging Die Level...
Micron Singapore, Singapore
Engineer, aptd cem. Advanced Packaging Die Level Technology EngineeringSingapore, Singapore*Our vision is to transform how the world uses information to...
13 days ago in JobleadsReport -
Engineer, Advanced Packaging Process and Equipment...
Micron Singapore, Singapore
Engineer, Advanced Packaging Process and Equipment Technology Development EngineeringSingapore, Singapore*Our vision is to transform how the world uses...
20 days ago in JobleadsReport -
Engineer, APTD CEM – Advanced Packaging Wafer Level...
Micron Singapore, Singapore
Engineer, APTD CEM – Advanced Packaging Wafer Level Technology EngineeringSingapore, Singapore*Our vision is to transform how the world uses information to...
13 days ago in JobleadsReport -
Principal/Senior Engineer, Advanced Packaging Die Level...
Micron Singapore, Singapore
Principal/Senior Engineer, Advanced Packaging Die Level Technology EngineeringSingapore, Singapore*Micron’s vision is to transform how the world uses...
30+ days ago in JobleadsReport -
Engineer, APTD CEM - Advanced Packaging Die Level...
Micron Singapore, Singapore
...and continuous improvement. Key responsibilities and duties include: Process Development: Develop and optimize assembly processes for advanced packaging...
15 days ago in FounditReport -
Principal/Senior Engineer, Advanced Packaging Wafer Level...
Micron D8, Singapore, Singapore
Principal/Senior Engineer, Advanced Packaging Wafer Level Technology EngineeringSingapore, SingaporeYour responsibilities include but are not limited to...
30+ days ago in JobrapidoReport
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